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MPC7447A

RISC Microprocessor Hardware Specifications

Freescale Semiconductor 

Electrical and Thermal Characteristics

Table 5. Package Thermal Characteristics1 (continued)

Characteristic

Symbol Value Unit Notes

Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board

RθJMA

16 °C/W 2, 4

Junction-to-board thermal resistance

RθJB

10 °C/W

5

Junction-to-case thermal resistance

RθJC

< 0.1 °C/W

6

Notes:

1. Refer to Section 9.8, “Thermal Management Information,” for details about thermal management.

2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.

3. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

4. Per JEDEC JESD51-6 with the board horizontal.

5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

6. This is the thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.

Table 6 provides the DC electrical characteristics for the MPC7447A.

Table 6. DC Electrical Specifications

At recommended operating conditions. See Table 4.

Characteristic

Input high voltage

(all inputs)

Input low voltage

(all inputs)

Input leakage current,

Vin = OVDD

Vin = GND

High-impedance (off-state) leakage current,

Vin = OVDD

Vin = GND

Output high voltage @ IOH = –5 mA

Output low voltage @ IOL = 5 mA

Nominal

Bus Symbol

Min

Voltage 1

Max

Unit Notes

1.8

VIH OVDD × 0.65 OVDD + 0.3 V

2

2.5

1.7

OVDD + 0.3

1.8

VIL

–0.3

OVDD × 0.35 V

2, 6

2.5

–0.3

0.7

—

Iin

—

µA 2, 3

30

– 30

—

ITSI

—

µA 2, 3, 4

30

– 30

1.8

VOH OVDD – 0.45

—

V

2.5

1.8

—

1.8

VOL

—

2.5

—

0.45

V

0.6

MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5

12

Freescale Semiconductor

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