NXP Semiconductors
PTN3460
eDP to LVDS bridge IC
10. Limiting values
Table 14. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
VDD
VI
Tstg
VESD
supply voltage
input voltage
storage temperature
electrostatic discharge
voltage
3.3 V CMOS inputs
HBM
CDM
[1] 0.3
[1] 0.3
65
[2] -
[3] -
Max
Unit
+4.6
V
VDD + 0.5 V
+150
C
8000
V
1000
V
[1] All voltage values, except differential voltages, are with respect to network ground terminal.
[2] Human Body Model: ANSI/EOS/ESD-S5.1-1994, standard for ESD sensitivity testing, Human Body Model
– Component level; Electrostatic Discharge Association, Rome, NY, USA.
[3] Charged-Device Model: ANSI/EOS/ESD-S5.3-1-1999, standard for ESD sensitivity testing,
Charged-Device Model – Component level; Electrostatic Discharge Association, Rome, NY, USA.
11. Recommended operating conditions
Table 15. Operating conditions
Over operating free-air temperature range, unless otherwise noted.
Symbol Parameter
Conditions
Min Typ Max Unit
VDD(3V3)
VDD(1V8)
VI
supply voltage (3.3 V)
supply voltage (1.8 V)
input voltage
3.3 V CMOS inputs
open-drain I/O with
respect to ground
(e.g., DDC_SCL,
DDC_SDA, MS_SDA,
MS_SCL)
3.0 3.3 3.6 V
1.7 1.8 1.9 V
0
3.3 3.6 V
0
5
5.5 V
Tamb
ambient temperature operating in free air
0
-
70
C
PTN3460
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 12 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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