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STPS1150(2006) Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza
componentes Descripción
Fabricante
STPS1150
(Rev.:2006)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STPS1150 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
STPS1150
2
Package information
Package information
Band shows cathode. Epoxy meets UL94, V0.
Table 4. SMA Package dimensions
E1
D
E
A1
C
A2
L
b
DIMENSIONS
REF. Millimeters
Inches
Min. Max. Min. Max.
A1 1.90 2.03 0.075 0.080
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.41 0.006 0.016
E 4.80 5.60 0.189 0.220
E1 3.95 4.60 0.156 0.181
D 2.25 2.95 0.089 0.116
L 0.75 1.60 0.030 0.063
Figure 15. SMA Foot Print Dimensions (in mm)
1.87
1.75
1.87
1.67
5.49
Table 5. DO-41 Package dimensions
C
A
C
DIMENSIONS
O/ B
REF. Millimeters Inches
Min. Max. Min. Max.
O/ D
O/ D
A 4.07 5.20 0.160 0.205
B 2.04 2.71 0.080 0.107
C 28
1.102
D 0.712 0.863 0.028 0.035
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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