S3C2440X Ver la hoja de datos (PDF) - Samsung

Número de pieza

componentes Descripción

Fabricante

S3C2440X

32-bit RISC microprocessor.

Samsung 

S3C2440X

2003.10.15

PRODUCT OVERVIEW

Pin

Number

T10

M11

N10

U12

M10

T11

L11

U13

H12

P17

N14

H14

D4

B5

D5

E5

R12

G6

F3

E1

F4

F5

D1

N13

C5

H16

F6

B2

C3

C4

D3

C2

D2

Table 1-2. S3C2440X 289-Pin FBGA Pin Assignments (Sheet 4 of 9)

Pin

Name

EINT16/GPG8

EINT17/nRTS1/GPG9

EINT18/nCTS1/GPG10

EINT19/TCLK1/GPG11

EINT20/GPG12

EINT21/GPG13

EINT22/GPG14

EINT23/GPG15

EXTCLK

UPLLCAP

MPLLCAP

nBATT_FLT

nBE0

nBE1

nBE2

nBE3

NCON

FRnB

nFWE/GPA19

nFRE/GPA20

nFCE/GPA22

CLE/GPA17

ALE/GPA18

nRSTOUT/GPA21

nOE

nRESET

nGCS0

nGCS1/GPA12

nGCS2/GPA13

nGCS3/GPA14

nGCS4/GPA15

nGCS5/GPA16

nGCS6

Default

Function

GPG8

GPG9

GPG10

GPG11

GPG12

GPG13

GPG14

GPG15

EXTCLK

UPLLCAP

MPLLCAP

nBATT_FLT

nBE0

nBE1

nBE2

nBE3

NCON

FRnB

GPA19

GPA20

GPA21

GPA17

GPA18

GPA21

nOE

nRESET

nGCS0

GPA12

GPA13

GPA14

GPA15

GPA16

nGCS6

I/O State I/O State

@BUS REQ @Sleep

–/–

–/–/–

–/–/–

–/–/–

–/–

–/–

–/–

–/–

–

–

–

–

Hi-z

Hi-z

Hi-z

Hi-z

–

–

O(H)/–

O(H)/–

O(H)/–

O(L)/–

O(L)/–

–/–

Hi-z

–

Hi-z

Hi-z/–

Hi-z/–

Hi-z/–

Hi-z/–

Hi-z/–

Hi-z

Hi-z/–

Hi-z/O(H)/–

Hi-z/Hi-z/–

Hi-z/Hi-z/–

Hi-z/–

Hi-z/–

Hi-z/–

Hi-z/–

–

–

–

–

Hi-z,O(H)

Hi-z,O(H)

Hi-z,O(H)

Hi-z,O(H)

–

Hi-z,O(L)

Hi-z,O(H)/–

Hi-z,O(H)/–

Hi-z,O(H)/–

Hi-z,O(L)/–

Hi-z,O(L)/–

O(L)/–

Hi-z,O(H)

–

Hi-z,O(H)

Hi-z,O(H)/–

Hi-z,O(H)/–

Hi-z,O(H)/–

Hi-z,O(H)/–

Hi-z,O(H)/–

Hi-z,O(H)

I/O State

@nRESET

I

I

I

I

I

I

I

I

AI

AI

AI

I

O(H)

O(H)

O(H)

O(H)

I

I

O(H)

O(H)

O(H)

O(L)

O(L)

O(L)

O(H)

I

O(H)

O(H)

O(H)

O(H)

O(H)

O(H)

O(H)

I/O Type

t8

t8

t8

t12

t12

t12

t12

t12

is

r50

r50

is

t10s

t10s

t10s

t10s

is

d2s

t10s

t10s

t10s

t10s

t10s

b8

t10s

is

t10s

t10s

t10s

t10s

t10s

t10s

t10s

Preliminary product information describes products that are in development,

for which full characterization data and associated errata are not yet available

Specifications and information herein are subject to change without notice.

1-13

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