S3C2440X Ver la hoja de datos (PDF) - Samsung

Número de pieza

componentes Descripción

Fabricante

S3C2440X

32-bit RISC microprocessor.

Samsung 

PRODUCT OVERVIEW

2003.10.15

S3C2440X

Table 1-2. S3C2440X 289-Pin FBGA Pin Assignments (Sheet 3 of 9)

Pin

Number

Pin

Name

E13

DATA19

E12

DATA20

E16

DATA21

F15

DATA22

G13

DATA23

E17

DATA24

G12

DATA25

F14

DATA26

F12

DATA27

G11

DATA28

G16

DATA29

H13

DATA30

F13

DATA31

P12

DN0

N11

DP0

N12

DN1/PDN0

U14

DP1/PDP0

N17

EINT0/GPF0

M16

EINT1/GPF1

L13

EINT2/GPF2

M15

EINT3/GPF3

M17

EINT4/GPF4

L14

EINT5/GPF5

L15

EINT6/GPF6

L16

EINT7/GPF7

N9

EINT8/GPG0

T9

EINT9/GPG1

J10

EINT10/nSS0/GPG2

R10

EINT11/nSS1/GPG3

P11 EINT12/LCD_PWREN/GPG4

K10

EINT13/SPIMISO1/GPG5

R11

EINT14/SPIMOSI1/GPG6

L10

EINT15/SPICLK1/GPG7

Default

Function

DATA19

DATA20

DATA21

DATA22

DATA23

DATA24

DATA25

DATA26

DATA27

DATA28

DATA29

DATA30

DATA31

DN0

DP0

DN1

DP1

GPF0

GPF1

GPF2

GPF3

GPF4

GPF5

GPF6

GPF7

GPG0

GPG1

GPG2

GPG3

GPG4

GPG5

GPG6

GPG7

I/O State I/O State

@BUS REQ @Sleep

Hi-z

Hi-z

Hi-z

Hi-z

Hi-z

Hi-z

Hi-z

Hi-z

Hi-z

Hi-z

Hi-z

Hi-z

Hi-z





–/–

–/–

–/–

–/–

–/–

–/–

–/–

–/–

–/–

–/–

–/–

–/–

–/–/–

–/–/–

–/–/–

–/–/–

–/–/–

–/–/–

Hi-z,O(L)

Hi-z,O(L)

Hi-z,O(L)

Hi-z,O(L)

Hi-z,O(L)

Hi-z,O(L)

Hi-z,O(L)

Hi-z,O(L)

Hi-z,O(L)

Hi-z,O(L)

Hi-z,O(L)

Hi-z,O(L)

Hi-z,O(L)









Hi-z/–

Hi-z/–

Hi-z/–

Hi-z/–

Hi-z/–

Hi-z/–

Hi-z/–

Hi-z/–

Hi-z/–

Hi-z/–

Hi-z/Hi-z/–

Hi-z/Hi-z/–

Hi-z/O(L)/–

Hi-z/Hi-z/–

Hi-z/Hi-z/–

Hi-z/Hi-z/–

I/O State

@nRESET

I

I

I

I

I

I

I

I

I

I

I

I

I

AI

AI

AI

AI

I

I

I

I

I

I

I

I

I

I

I

I

I

I

I

I

I/O Type

b12s

b12s

b12s

b12s

b12s

b12s

b12s

b12s

b12s

b12s

b12s

b12s

b12s

us

us

us

us

t8

t8

t8

t8

t8

t8

t8

t8

t8

t8

t8

t8

t8

tt8

tt8

tt8

1-12

Preliminary product information describes products that are in development,

for which full characterization data and associated errata are not yet available

Specifications and information herein are subject to change without notice.

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