HSDL-3200 Ver la hoja de datos (PDF) - LiteOn Technology
Número de pieza
componentes Descripción
Fabricante
HSDL-3200 Datasheet PDF : 14 Pages
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Moisture Proof Packaging
The HSDL-3200 is shipped in
moisture proof packaging. Once
opened, moisture absorption
begins.
Solder Pad, Mask and Metal Stencil
STENCIL
APERTURE
METAL STENCIL
FOR SOLDER PASTE
PRINTING
Recommended Storage
Conditions
Storage Temperature 10°C to 30°C
Relative Humidity
Below 60%
Time from Unsealing to
Soldering
After removal from the bag, the
parts should be soldered within
three days if stored at the
recommended storage
conditions.
SOLDER
MASK
LAND
PATTERN
PCB
HSDL-3200#021 Recommended Land Pattern (Front Option)
Baking
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
In Reels
In Bulk
60°C, t ≥ 48 hours
100°C, t ≥ 4 hours
125°C, T ≥ 2 hours
150°C, T ≥ 1 hour
Baking should only be done
once.
Tx LENS
Rx LENS
e
b
a
FIDUCIAL
d SHIELD SOLDER PAD
g
Y
theta
8x PAD
X
c
DIMENSION mm
INCHES
a
1.75
0.069
b
0.60
0.024
f
c (PITCH) 0.95
0.037
d
1.25
0.049
e
2.70
0.106
f
2.20
0.087
g
2.28
0.089
FIDUCIAL
HSDL-3200-028 Recommended Land Pattern (Top Options)
2.20
1.45
;;;;;;;;; 1.275
0.9
MOUNTING CENTER
0.575
;;;;;;;;;;;1.60
0.60
PITCH 7 x 0.95
3.625
9
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