HSDL-3200 Ver la hoja de datos (PDF) - LiteOn Technology

Número de pieza

componentes Descripción

Fabricante

HSDL-3200

IrDA® Data 1.4 Compliant 115.2 Kb/s Infrared Transceiver

LiteOn Technology 

IR Transceiver Reflow Profile: Lead-free

255

230

220

200

180

R2

160

120

R1

MAX. 260°C

R3

R4

60 sec.

MAX.

ABOVE

220°C

R5

80

25

0

50

100

150

200

250

300

P1

HEAT

UP

t-TIME (SECONDS)

P2

SOLDER PASTE DRY

P3

SOLDER

REFLOW

P4

COOL

DOWN

Process Zone

Heat Up

Solder Paste Dry

Solder Reflow

Cool Down

Symbol

P1, R1

P2, R2

P3, R3

P3, R4

P4, R5

DT

25°C to 160°C

160°C to 200°C

200°C to 255°C (260°C at 10 seconds max.)

255°C to 200°C

200°C to 25°C

Maximum DT/Dtime

4°C/s

0.5°C/s

4°C/s

-6°C/s

-6°C/s

The reflow profile is a straight-

line representation of a nominal

temperature profile for a

convective reflow solder

process. The temperature profile

is divided into four process

zones, each with different

DT/Dtime temperature change

rates. The DT/Dtime rates are

detailed in the above table. The

temperatures are measured at

the component to printed circuit

board connections.

In process zone P1, the PC

board and HSDL-3200

castellation I/O pins are heated

to a temperature of 160°C to

activate the flux in the solder

paste. The temperature ramp up

rate, R1, is limited to 4°C per

second to allow for even heating

of both the PC board and HSDL-

3200 castellation I/O pins.

Process zone P2 should be of

sufficient time duration (60 to

120 seconds) to dry the solder

paste. The temperature is raised

to a level just below the liquidus

point of the solder, usually

200° C (392° F).

Process zone P3 is the solder

reflow zone. In zone P3, the

temperature is quickly raised

above the liquidus point of

solder to 255° C (491° F) for

optimum results. The dwell time

above the liquidus point of

solder should be between 20 and

60 seconds. It usually takes

about 20 seconds to assure

proper coalescing of the solder

balls into liquid solder and the

formation of good solder

connections. Beyond a dwell

time of 60 seconds, the

intermetallic growth within the

solder connections becomes

excessive, resulting in the

formation of weak and

unreliable connections. The

temperature is then rapidly

reduced to a point below the

solidus temperature of the

solder, usually 200° C (392° F), to

allow the solder within the

connections to freeze solid.

Process zone P4 is the cool

down after solder freeze. The

cool down rate, R5, from the

liquidus point of the solder to

25°C (77°F) should not exceed

6° C per second maximum. This

limitation is necessary to allow

the PC board and HSDL-3200

castellation I/O pins to change

dimensions evenly, putting

minimal stresses on the HSDL-

3200 transceiver.

8

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