MC33363BDW Ver la hoja de datos (PDF) - ON Semiconductor
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componentes Descripción
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MC33363BDW Datasheet PDF : 11 Pages
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MC33363B
3.2
CT = 390 pF
2.4
CT = 2.0 nF
100
L = 12.7 mm of 2.0 oz.
copper. Refer to Figures
16 and 17.
1.6
RT = 10 k
0.8
Pin 1 = Open
Pin 4, 5, 10, 11,
12, 13 = GND
TA = 25°C
0
0
10
20
30
40
VCC, SUPPLY VOLTAGE (V)
Figure 14. Supply Current versus Supply Voltage
10
1.0
0.01
0.1
1.0
10
100
t, TIME (s)
Figure 15. DW and P Suffix Transient
Thermal Resistance
100
2.8
PD(max) for TA = 50°C
90
2.4
80
70
Printed circuit board heatsink example
ÎÎÎÎÎÎÎÎÎÎ L
2.0 oz
Copper
2.0
1.6
60
1.2
L
3.0 mm
50
Graphs represent symmetrical layout 0.8
RqJA
40
0.4
30
0
0
10
20
30
40
50
L, LENGTH OF COPPER (mm)
Figure 16. DW Suffix (SOP−16L) Thermal Resistance and
Maximum Power Dissipation versus P.C.B. Copper Length
100
5.0
80
Printed circuit board heatsink example
ÎÎÎÎÎÎÎÎÎÎ L
2.0 oz
Copper
4.0
60
RqJA
L
3.0 mm
Graphs represent symmetrical layout
3.0
40
2.0
20
PD(max) for TA = 70°C
1.0
0
0
0
10
20
30
40
50
L, LENGTH OF COPPER (mm)
Figure 17. P Suffix (DIP−16) Thermal Resistance and
Maximum Power Dissipation versus P.C.B. Copper Length
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