PESD5V0U5BF Ver la hoja de datos (PDF) - NXP Semiconductors.
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PESD5V0U5BF Datasheet PDF : 12 Pages
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NXP Semiconductors
11. Soldering
PESD5V0U5BF; PESD5V0U5BV
Ultra low capacitance bidirectional fivefold ESD protection arrays
1.250
0.675
0.370
(6×)
0.270
(6×)
0.325
(6×)
0.500
1.700
0.500
0.425
(6×)
solder lands
solder paste
occupied area
Dimensions in mm
sot886_fr
Reflow soldering is the only recommended soldering method.
Fig 8. Reflow soldering footprint PESD5V0U5BF (SOT886)
2.75
2.45
2.1
1.6
0.538
2 1.7 1.075
0.55
(2×)
0.4
(6×) 0.25 0.3
(2×) (2×)
1.7
0.45
0.6
(4×)
(2×)
0.5
0.65
(4×)
(2×)
0.325 0.375
(4×) (4×)
Reflow soldering is the only recommended soldering method.
Fig 9. Reflow soldering footprint PESD5V0U5BV (SOT666)
solder lands
placement area
solder paste
occupied area
Dimensions in mm
sot666_fr
PESD5V0U5BF_PESD5V0U5BV_1
Product data sheet
Rev. 01 — 15 August 2008
© NXP B.V. 2008. All rights reserved.
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