AD7173-8(Rev0) Ver la hoja de datos (PDF) - Analog Devices

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componentes Descripción

Fabricante

AD7173-8
(Rev.:Rev0)

Low Power, 8-/16-Channel, 31.25 kSPS, 24-Bit, Highly Integrated Sigma-Delta ADC

Analog Devices 

AD7173-8

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter

AVDD1, AVDD2 to AVSS

AVDD1 to DGND

IOVDD to DGND

IOVDD to AVSS

AVSS to DGND

Analog Input Voltage to AVSS

Reference Input Voltage to AVSS

Digital Input Voltage to DGND

Digital Output Voltage to DGND

AIN[16:0] or Digital Input Current

Operating Temperature Range

Storage Temperature Range

Maximum Junction Temperature

Lead Soldering, Reflow Temperature

ESD Rating (HBM)

Rating

−0.3 V to +6.5 V

−0.3 V to +6.5 V

−0.3 V to +6.5 V

−0.3 V to +7.5 V

−3.25 V to +0.3 V

−0.3 V to AVDD1 + 0.3 V

−0.3 V to AVDD1 + 0.3 V

−0.3 V to IOVDD + 0.3 V

−0.3 V to IOVDD + 0.3 V

10 mA

−40°C to +105°C

−65°C to +150°C

150°C

260°C

4 kV

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Data Sheet

THERMAL RESISTANCE

θJA is specified for a device soldered on a JEDEC test board for

surface-mount packages. The values listed in Table 4 are based

on simulated data.

Table 4. Thermal Resistance

Package Type

θJA

Unit

40-Lead, 6 mm × 6 mm LFCSP

1-Layer JEDEC Board

114 °C/W

4-Layer JEDEC Board

54 °C/W

4-Layer JEDEC Board with 16 Thermal Vias 34 °C/W

ESD CAUTION

Rev. 0 | Page 8 of 64

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