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UP7706 Ver la hoja de datos (PDF) - Unspecified

Número de pieza
componentes Descripción
Fabricante
UP7706 Datasheet PDF : 12 Pages
First Prev 11 12
0.76 REF
PSOP-8 Package
1.27 REF
2.39 REF
uP7706
Application Information
4.80 - 5.00
2.29 BSC
1.27 BSC
0.32 - 0.52
Recommended Solder Pad Layout
1.45 - 1.60
0.20 BSC
0.41 - 0.89
0.18 - 0.25
1.75 MAX
3.81 BSC
0.10 - 0.25
Note
1.Package Outline Unit Description:
BSC: Basic. Represents theoretical exact dimension or dimension target
MIN: Minimum dimension specified.
MAX: Maximum dimension specified.
REF: Reference. Represents dimension for reference use only. This value is not a device specification.
TYP. Typical. Provided as a general value. This value is not a device specification.
2.Dimensions in Millimeters.
3.Drawing not to scale.
4.These dimensions no not include mold flash or protrusions. Mold flash or protrusions shell not exceed 0.15mm.
uPI Semiconductor Corp., http://www.upi-semi.com
11
Rev. F00, File Name: uP7706-DS-F0000

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