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UP7706 Ver la hoja de datos (PDF) - Unspecified

Número de pieza
componentes Descripción
Fabricante
UP7706 Datasheet PDF : 12 Pages
First Prev 11 12
4.90 - 5.10
VDFN6x5-8L Package
0.50 - 0.75
5
uP7706
Application Information
3.90 - 4.10
8
4
1.27 BSC
3.90 - 4.10
1
0.35 - 0.48
0.20 REF
0.00 - 0.05
1.27 BSC
0.40 - 0.50
Recommended Solder Pitch and Dimensions
Note
1.Package Outline Unit Description:
BSC: Basic. Represents theoretical exact dimension or dimension target
MIN: Minimum dimension specified.
MAX: Maximum dimension specified.
REF: Reference. Represents dimension for reference use only. This value is not a device specification.
TYP. Typical. Provided as a general value. This value is not a device specification.
2.Dimensions in Millimeters.
3.Drawing not to scale.
4.These dimensions no not include mold flash or protrusions. Mold flash or protrusions shell not exceed 0.15mm.
uPI Semiconductor Corp., http://www.upi-semi.com
12
Rev. F00, File Name: uP7706-DS-F0000

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