HCPL-257K-100 Ver la hoja de datos (PDF) - HP => Agilent Technologies

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HCPL-257K-100

Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications

HP => Agilent Technologies 

capability will enable the designer

to interface any TTL family to

CMOS. The availability of the

base lead allows optimized gain/

bandwidth adjustment in analog

applications. The shallow depth

of the IC photodiode provides

better radiation immunity than

conventional phototransistor

couplers.

These products are also available

with the transistor base node

connected to improve common

mode noise immunity and ESD

susceptibility. In addition, higher

CTR minimums are available by

special request.

Package styles for these parts are

8 and 16 pin DIP through hole

(case outlines P and E respec-

tively), 16 pin DIP flat pack (case

outline F), and leadless ceramic

chip carrier (case outline 2).

Devices may be purchased with a

variety of lead bend and plating

options, see Selection Guide

Table for details. Standard

Military Drawing (SMD) parts are

available for each package and

lead style.

similarities give justification for

the use of data obtained from one

part to represent other part’s

performance for die related

reliability and certain limited

radiation test results.

Because the same functional die

(emitters and detectors) are used

for each channel of each device

listed in this data sheet, absolute

maximum ratings, recommended

operating conditions, electrical

specifications, and performance

characteristics shown in the

figures are identical for all parts.

Occasional exceptions exist due

to package variations and

limitations and are as noted.

Additionally, the same package

assembly processes and materials

are used in all devices. These

8 Pin Ceramic DIP Single

Channel Schematic

2 IF

ANODE

+

VF

–

CATHODE

3

ICC 8

VCC

IB 7

VB

IO 6

VO

5

GND

Note base pin 7.

Selection Guide–Package Styles and Lead Configuration Options

Package

Lead Style

Channels

Common Channel Wiring

HP Part # & Options

Commercial

MIL-PRF-38534, Class H

MIL-PRF-38534, Class K

Standard Lead Finish

Solder Dipped

Butt Cut/Gold Plate

Gull Wing/Soldered

SMD Part #

Prescript for all below

Either Gold or Solder

Gold Plate

Solder Dipped

Butt Cut/Gold Plate

Butt Cut/Soldered

Gull Wing/Soldered

16 Pin DIP

Through Hole

2

None

4N55*

4N55/883B

HCPL-257K

Gold Plate

Option #200

Option #100

Option #300

5962-

8767901EX

8767901EC

8767901EA

8767901UC

8767901UA

8767901TA

8 Pin DIP

Through Hole

1

None

HCPL-5500

HCPL-5501

HCPL-550K

Gold Plate

Option #200

Option #100

Option #300

5962-

9085401HPX

9085401HPC

9085401HPA

9085401HYC

9085401HYA

9085401HXA

8 Pin DIP

Through Hole

2

VCC GND

16 Pin Flat Pack

Unformed Leads

4

VCC GND

HCPL-5530

HCPL-5531

HCPL-553K

Gold Plate

Option #200

Option #100

Option #300

HCPL-6550

HCPL-6551

HCPL-655K

Gold Plate

5962-

8767902PX

8767902PC

8767902PA

8767902YC

8767902YA

8767902XA

5962-

8767904FX

8767904FC

20 Pad LCCC

Surface Mount

2

None

HCPL-6530

HCPL-6531

HCPL-653K

Solder Pads

5962-

87679032X

87679032A

*JEDEC registered part.

1-560

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