WED3C7558M-XBX Ver la hoja de datos (PDF) - White Electronic Designs Corporation

Número de pieza

componentes Descripción

Fabricante

WED3C7558M-XBX

RISC Microprocessor Multichip Package

White Electronic Designs Corporation 

White Electronic Designs

WED3C7558M-XBX

FIGURE 5 – PIN ASSIGNMENTS

Ball assignments of the 255 CBGA package as viewed from the top surface.

Side profile of the CBGA package to indicate the direction of the top surface view.

August 2002

Rev. 7

4

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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