WED3C7558M-XBX Ver la hoja de datos (PDF) - White Electronic Designs Corporation

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componentes Descripción

Fabricante

WED3C7558M-XBX

RISC Microprocessor Multichip Package

White Electronic Designs Corporation 

White Electronic Designs

WED3C7558M-XBX

Ordering Information

WED 3 C 755 8M X B X

DEVICE GRADE:

M = Military Screened -55°C to +125°C

I = Industrial

-40°C to +85°C

C = Commercial

0°C to +70°C

PACKAGE TYPE:

B = 255 Ceramic Ball Grid Array

CORE FREQUENCY (MHz)

350 = 350MHz/175MHz L2 cache

300 = 300MHz/150MHz L2 cache

L2 CACHE DENSITY:

8Mbits = 128K x 72 SSRAM

PowerPC™:

Type 755 (D - Die Revision)

C = MULTICHIP PACKAGE

3 = PowerPC™

WHITE ELECTRONIC DESIGNS CORP.

PowerPC™ is a trademark of International Business Machine Corp.

August 2002

Rev. 7

13

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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