UBA2080(2011) Ver la hoja de datos (PDF) - NXP Semiconductors.
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UBA2080 Datasheet PDF : 15 Pages
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NXP Semiconductors
12. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
UBA2080/1
Half-bridge driver IC
SOT96-1
D
y
Z
8
c
5
E
A
X
HE
vM A
pin 1 index
1
e
A2
A1
4
bp
wM
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1
A2
A3
bp
c
D(1) E(2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25 0.25
0.1
0.7
0.3
8o
inches
0.069
0.010
0.004
0.057
0.049
0.01
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.05
0.244
0.228
0.041
0.039
0.016
0.028
0.024
0.01
0.01
0.004
0.028
0.012
0o
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT96-1
IEC
076E03
REFERENCES
JEDEC
JEITA
MS-012
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 9. Package outline SOT96-1
UBA2080_UBA2081
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 6 December 2011
© NXP B.V. 2011. All rights reserved.
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