UBA2080(2011) Ver la hoja de datos (PDF) - NXP Semiconductors.
Número de pieza
componentes Descripción
Fabricante
UBA2080 Datasheet PDF : 15 Pages
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NXP Semiconductors
DIP8: plastic dual in-line package; 8 leads (300 mil)
UBA2080/1
Half-bridge driver IC
SOT97-1
D
L
Z
e
b
8
A2 A
A1
wM
b1
b2
5
pin 1 index
E
ME
c
(e 1)
MH
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
min. max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches 0.17
0.02
0.13
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT97-1
IEC
050G01
REFERENCES
JEDEC
JEITA
MO-001
SC-504-8
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 10. Package outline SOT97-1
UBA2080_UBA2081
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 6 December 2011
© NXP B.V. 2011. All rights reserved.
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