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Fabricante

TDA7266SAN

5 W + 5 W dual bridge amplifier

STMicroelectronics 

TDA7266SAN

7

Heatsink dimensioning

Heatsink dimensioning

In order to avoid triggering the thermal protection which is set approximatively at Tj = 150°C,

it is important to correctly dimension the heat sinker RTh (°C/W).

The parameters that influence the dimensioning are:

● Maximum dissipated power for the device (Pdmax)

● Max. thermal resistance junction to case (RTh j-c)

● Max. ambient temperature Tamb max

● Quiescent current Iq (mA)

Example:

VCC = 9.5 V, Rload = 8 ohm, RTh j-c = 2.5 °C/W , Tamb max = 50 °C

Pdmax

=

(Nochannels)

•

-------V-----C---C----2--------

Π2

•

-R----l-o---a---d-

2

+

Iq

•

VCC

Pdmax = 2 • (2.3) + 0.47= 5.07W

(HeatSinker)RTh

c–a

=

1----5---0-----–-----T---a---m-----b-----m----a---x-

Pdmax

–

RTh

j – c=

⎛

⎝

1----5---0-----–-----5---0--

5.07

–

2.5⎠⎞

=

17.2oC/W

Figure 14 shows the power derating curve for the device.

Figure 14. Power derating curve

25

20

(a)

15

(b)

10

(c)

5

a) Infinite Heatsink

b) 7 °C/ W

c) 10 °C/ W

0

0

40

80

120

160

Tamb (°C)

Doc ID 023621 Rev 1

11/15

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