TDA7266SAN Ver la hoja de datos (PDF) - STMicroelectronics

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TDA7266SAN

5 W + 5 W dual bridge amplifier

STMicroelectronics 

Package mechanical data

8

Package mechanical data

TDA7266SAN

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Clipwatt assembly suggestions

The recommended mounting method of the Clipwatt on an external heatsink requires the

use of a clip placed as close as possible to the center of the plastic body, as indicated in the

example of Figure 15.

A thermal grease can be used in order to reduce the additional thermal resistance of the

contact between the package and heatsink.

A force of 7 - 10 kg gives a good contact and the clip must be designed in order to withstand

a maximum contact pressure of 15 kg/mm2 between itself and the plastic body case.

For example, if a 15 kg force is applied by the clip on the package, the clip must have a

contact area of at least 1 mm2.

Figure 15. Example of right placement of the clip

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Doc ID 023621 Rev 1

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