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SCA10X0

Assembly Instructions for SCA6x0 and SCA10x0 series

VTI technologies 

Assembly Instructions for SCA6x0 and SCA10x0 series

TN71

4. Devices require bake, before mounting, if:

a) Humidity Indicator Card is > 10% when read at 23 ± 5 °C

b) 3a or 3b not met.

5. If baking is required, devices may be baked for 24 hours at 85°C.

Note: Also Tape&Reel materials are applicable for baking at 85°C

Note: Packing materials and procedures according to IPC/JEDEC J-STD-033

Note: Level and body temperature defined by IPC/JEDEC J-STD-020

5.8 Inspection

Optical and visual inspection of solder joints can be done easily, since the solder joints are clearly

seen. A visual inspection of the solder joints with conventional AOI (automatic optical inspection)

system can be used. Also X-ray inspection can be used.

Cross-sectional analysis is also an approved method to inspect how well solder has wetted the

pads of component. Cross-sectional analysis is not used for production inspection, but if required, it

can be used to establish and optimize the component assembly process parameters. Cross-

sectioning is a destructive inspection method. An example of a DIL solder joint cross-section in

presented in Figure 9.

mag.

x5

mag.

x20

mag.

x50

Figure 9: Cross-section of the DIL package lead's solder joint (with eutectic SnPb solder).

VTI Technologies Oy

www.vti.fi

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