SCA10X0 Ver la hoja de datos (PDF) - VTI technologies

Número de pieza

componentes Descripción

Fabricante

SCA10X0

Assembly Instructions for SCA6x0 and SCA10x0 series

VTI technologies 

Technical Note 71

Assembly Instructions for SCA6x0 and SCA10x0 series

TABLE OF CONTENTS

Table of Contents .....................................................................................................................1

1 Objective ..............................................................................................................................2

2 VTI'S DIL-8 and DIL-12 packages.......................................................................................2

3 Package Outline and Dimensions......................................................................................2

4 Tape and reel specifications ..............................................................................................3

5 Printed Circuit Board (PCB) Level Guidelines ..................................................................5

5.1 Recommended PCB pad layout................................................................................................5

5.2 Solder paste and Cleaning process .........................................................................................5

5.3 Stencil .........................................................................................................................................6

5.4 Paste printing .............................................................................................................................6

5.5 Component picking and placement .........................................................................................6

5.6 Reflow soldering ........................................................................................................................6

5.7 Moisture sensitivity level (MSL) classification........................................................................7

5.8 Inspection ...................................................................................................................................8

6 Hand Soldering Guidelines ................................................................................................9

7 Rework Guidelines ............................................................................................................10

7.1 Instructions for desoldering and removing of component..................................................10

8 Environmental Aspects ....................................................................................................11

9 References.........................................................................................................................11

10 Document Change Control...............................................................................................12

Share Link: