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RT8251GSP Ver la hoja de datos (PDF) - Richtek Technology

Número de pieza
componentes Descripción
Fabricante
RT8251GSP
Richtek
Richtek Technology Richtek
RT8251GSP Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
RT8251
GND
Input capacitor must
be placed as close
to the IC as possible.
VIN SW GND
CBOOT
CIN
BOOT
VIN
2
D
SW
3
CS RS GND
4
8
7
GND
6
9
5
The feedback components
must be connected as close
to the device as possible.
CSS
CC
SS
EN
CP RC
COMP
R1
FB
COUT
L
R2 VOUT
VOUT
SW should be connected to inductor by
wide and short trace. Keep sensitive
components away from this trace.
GND
Figure 10. PCB Layout Guide for PSOP-8 Package
Table 3. Suggested Capacitors for CIN and COUT
Location Component Supplier
Part No.
CI N
MURATA
GRM31ER61E226K
CI N
TDK
C4535X5R1E226M
CI N
TAIYO YUDEN
TMK325BJ226MM
COUT
MURATA
GRM32ER61C476M
COUT
MURATA
GRM31C R60J 476M
COUT
TDK
C3216X5R0J476M
COUT
TAIYO YUDEN
LMK316BJ476MM
Capacitance (μF)
22
22
22
47
47
47
47
Table 4. Suggested Diode
Component Supplier
Part No.
DIODES
B54 0C
ON
MBR S54 0T3
VRRM (V)
40
40
IOUT (A)
5
5
P acka ge
SMC
SMC
Case Size
1210
1812
1210
1210
1206
1206
1206
Copyright ©2013 Richtek Technology Corporation. All rights reserved.
www.richtek.com
14
is a registered trademark of Richtek Technology Corporation.
DS8251-04 February 2013

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