RT8251GSP Ver la hoja de datos (PDF) - Richtek Technology
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RT8251GSP Datasheet PDF : 16 Pages
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RT8251
Layout Consideration
Follow the PCB layout guidelines for optimal performance
of the RT8251.
` Keep the traces of the main current paths as short and
wide as possible.
` Put the input capacitor as close as possible to the device
pins (VIN and GND).
` LX node is with high frequency voltage swing and should
be kept at small area. Keep analog components away
from the LX node to prevent stray capacitive noise pick-
up.
` Connect feedback network behind the output capacitors.
Keep the loop area small. Place the feedback
components near the RT8251.
` Connect all analog grounds to a command node and
then connect the command node to the power ground
behind the output capacitors.
` Examples of PCB layout guide are shown in Figure 9
and Figure 10 for reference.
Input capacitor must be placed
as close as to the IC as possible.
COUT
GND
CIN
D
CS
RS
L
16 15 14 13
VOUT
VIN 1
VIN 2
VIN 3
GND 4
GND
17
12 SW
11 SW
10 SW
9 BOOT CBOOT
SW should be connected
to inductor by Wide and
short trace. Keep sensitive
components away from
5678
this trace.
R1 R2
RC
VOUT
CC
GND
CSS
CP
The feedback components must be connected
as close to the device as possible.
Figure 9. PCB Layout Guide for WQFN Package
Copyright ©2013 Richtek Technology Corporation. All rights reserved.
DS8251-04 February 2013
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
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