HTG2150 Ver la hoja de datos (PDF) - Holtek Semiconductor
Número de pieza
componentes Descripción
Fabricante
HTG2150 Datasheet PDF : 38 Pages
| |||
Pad Assignment
HTG2150
S E G 25
1 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47
S E G 26
2
S E G 27
3
S E G 28
4
S E G 29
5
S E G 30
6
S E G 31
7
S E G 32
8
P B 4 /S E G 3 3
9
P B 5 /S E G 3 4
10
P B 6 /S E G 3 5
11
P B 7 /S E G 3 6
12
IN T /S E G 3 7
13
X O U T /S E G 3 8
14
X IN /S E G 3 9
15
RES
16 17
18 19 20
46 S E G 8
45 S E G 7
44 S E G 6
43 S E G 5
42 S E G 4
41 S E G 3
40 S E G 2
39 S E G 1
(0 ,0 )
38 S E G 0
37 C O M 7
36 C O M 6
35 C O M 5
34 C O M 4
33 C O M 3
32 C O M 2
31 C O M 1
30 C O M 0
22 23 24 25 26 27 28 29
21
* The IC substrate should be connected to VSS in the PCB layout artwork.
Pad Coordinates
Pad No.
1
2
3
4
5
6
7
8
9
10
11
12
X
-880.45
-887.11
-887.11
-887.11
-887.11
-887.11
-887.11
-887.11
-822.70
-822.70
-822.70
-822.70
Y
1114.46
872.13
765.63
659.03
552.53
445.93
339.43
232.83
103.48
-13.52
-127.52
-244.52
Pad No.
32
33
34
35
36
37
38
39
40
41
42
43
X
882.36
882.36
882.36
882.36
882.36
882.36
882.36
882.36
882.36
882.36
882.36
882.36
Unit: mm
Y
-639.47
-532.87
-426.37
-319.77
-213.27
-106.67
-0.17
106.43
212.93
319.53
426.03
532.63
Rev. 1.30
4
May 21, 2002
Share Link: 