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FDS6064N7 Ver la hoja de datos (PDF) - Fairchild Semiconductor

Número de pieza
componentes Descripción
Fabricante
FDS6064N7
Fairchild
Fairchild Semiconductor Fairchild
FDS6064N7 Datasheet PDF : 6 Pages
1 2 3 4 5 6
Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage VGS = 0 V,
ID = 250 µA
20
∆BVDSS
∆TJ
Breakdown Voltage Temperature ID = 250 µA, Referenced to 25°C
Coefficient
IDSS
Zero Gate Voltage Drain Current VDS = 16 V,
VGS = 0 V
IGSSF
Gate–Body Leakage, Forward
VGS = 8 V,
VDS = 0 V
IGSSR
Gate–Body Leakage, Reverse
VGS = –8 V , VDS = 0 V
V
11
mV/°C
1
µA
100 nA
–100 nA
On Characteristics
(Note 2)
VGS(th)
Gate Threshold Voltage
∆VGS(th)
∆TJ
RDS(on)
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
gFS
Forward Transconductance
VDS = VGS,
ID = 250 µA
0.4
0.6
1.5
V
ID = 250 µA, Referenced to 25°C
–3
mV/°C
VGS = 4.5 V, ID = 23 A
VGS = 2.5 V, ID = 22 A
VGS = 1.8 V, ID = 18 A
VGS = 4.5 V, ID = 23 A,TJ = 125°C
VDS = 5 V,
ID = 23 A
2.2
3.5
mΩ
2.7
4
3.4
6
3
5
179
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
RG
Gate Resistance
VDS = 10 V,
f = 1.0 MHz
V GS = 0 V,
VGS = 15 mV, f = 1.0 MHz
7191
pF
1403
pF
703
pF
1.2
Ω
Switching Characteristics
td(on)
Turn–On Delay Time
tr
Turn–On Rise Time
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qgs
Gate–Source Charge
Qgd
Gate–Drain Charge
(Note 2)
VDD = 10 V,
VGS = 4.5 V,
ID = 1 A,
RGEN = 6 Ω
VDS = 10 V,
VGS = 4.5 V
ID = 23 A,
22
35
ns
22
35
ns
153 245
ns
77
123
ns
70
98
nC
10
nC
15
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V, IS = 2.5 A
trr
Diode Reverse Recovery Time IF = 23 A,
Qrr
Diode Reverse Recovery Charge diF/dt = 100 A/µs
Notes:
(Note 2)
2.5
A
0.6
1.2
V
43
nS
55
nC
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 40°C/W when
mounted on a 1in2 pad
of 2 oz copper
b) 85°C/W when mounted on
a minimum pad of 2 oz
copper
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDS6064N7 Rev D2 (W)

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