STPS20150C
Figure 7: Junction capacitance versus reverse
voltage applied (typical values, per diode)
C(pF)
1000
F=1MHz
Tj=25°C
Characteristics
Figure 8: Forward voltage drop versus forward
current (per diode)
100
10
1
2
VR(V)
5
10
20
50
100
200
Figure 9: Thermal resistance junction to ambient versus copper surface under tab for D²PAK
(typical values)
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
0
0
Epoxy printed board FR4, eCU= 35 µm
SCu(cm²)
5
10
15
20
25
30
35
40
DocID7756 Rev 11
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