STPS0520Z Ver la hoja de datos (PDF) - STMicroelectronics
Número de pieza
componentes Descripción
Fabricante
STPS0520Z Datasheet PDF : 5 Pages
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STPS0520Z
Fig. 1: Average forward power dissipation versus
average forward current
Fig. 2: Average forward current versus ambient
temperature (δ = 0.5)
PF(av)(W)
0.25
δ = 0.05 δ = 0.1 δ = 0.2
0.20
0.15
δ = 0.5
δ=1
0.10
T
0.05
IF(av) (A)
δ=tp/T
tp
0.00
0.0
0.1
0.2
0.3
0.4
0.5
0.6
IF(av)(A)
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
T
δ=tp/T
tp
25
Tamb(°C)
50
75
100
125
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values).
IM(A)
3.0
2.5
2.0
1.5
1.0
IM
0.5
t
δ=0.5
0.0
1E-3
Ta=25°C
Ta=50°C
Ta=75°C
t(s)
1E-2
1E-1
1E+0
Fig. 4: Relative variation of thermal impedance
junction to ambient versus pulse duration (Epoxy
printed circuit board FR4 with recommended pad
layout).
Zth(j-a)/Rth(j-a)
1E+0
δ = 0.5
δ = 0.2
δ = 0.1
1E-1
1E-2
Single pulse
1E-3
1E-3
1E-2
tp(s)
1E-1 1E+0
T
δ=tp/T
1E+1
tp
1E+2
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values).
Fig. 6: Relative variation of reverse leakage cur-
rent versus junction temperature (typical values).
IR(mA)
2E+1
1E+1
1E+0
Tj=125°C
Tj=100°C
Tj=70°C
1E-1
1E-2
Tj=25°C
VR(V)
1E-3
0 2 4 6 8 10 12 14 16 18 20
IR[Tj] / IR[Tj=25°C]
1E+3
VR=VRRM
1E+2
1E+1
1E+0
1E-1
0
Tj(°C)
25
50
75
100
125
3/5
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