UT1750AR(2003) Ver la hoja de datos (PDF) - Aeroflex UTMC

Número de pieza

componentes Descripción

Fabricante

UT1750AR
(Rev.:2003)

RadHard RISC Microprocessor

Aeroflex UTMC 

Notes:

1. Package material: Opaque ceramic.

2. True position applies at base plane (Datum C).

3. True position applies at pin tips (Datum C1).

4. All package finishes are per MIL-PRF-38535.

5. Letter designations are for cross-reference MIL-STD-1835.

6. Geometry of index mark cannot be an alpha or numeric

symbol.

7. All VD D pads are connected to the power plane, die-attach,

pad and external pins H3, N9, G13, and C7.

8. All VS S pads are connected to the power plane, die-attach,

pad and external pins J3, N8, H13, and C8.

Pin Usage: PGA

116 - I/O

8 - Power/Ground

23 - No connect (B13, C2,

N14, P3, R1, D3, M13, A15,

E1, A1, L2, N4, R5, B5, P11,

A11, C12, E14, R15, L15)

Figure 44. 144-Pin Pingrid Array

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