CXA1726 Ver la hoja de datos (PDF) - Sony Semiconductor

Número de pieza

componentes Descripción

Fabricante

CXA1726

Multiplier IC for Displays

Sony Semiconductor 

Package Outline

Unit: mm

CXA1726AM

30

30PIN SOP(PLASTIC)

+ 0.4

18.8 – 0.1

16

+ 0.4

2.3 – 0.15

0.1

+ 0.2

0.1 – 0.05

A

1

0.45 ± 0.1

0.2 M

15

1.27

+ 0.1

0.2 – 0.05

CXA1726AM/AS

0° to 10°

DETAIL A

CXA1726AS

SONY CODE

EIAJ CODE

JEDEC CODE

SOP-30P-L03

SOP030-P-0375

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

COPPER ALLOY

PACKAGE MASS

0.7g

30PIN SDIP (PLASTIC)

+ 0.4

26.9 – 0.1

30

16

1

15

1.778

0° to 15°

0.5 ± 0.1

0.9 ± 0.15

Two kinds of package surface:

1.All mat surface type.

2.All mirror surface type.

SONY CODE

EIAJ CODE

JEDEC CODE

SDIP-30P-01

SDIP030-P-0400

PACKAGE STRUCTURE

MOLDING COMPOUND EPOXY RESIN

LEAD TREATMENT

SOLDER/PALLADIUM

PLATING

LEAD MATERIAL

COPPER ALLOY

PACKAGE MASS

1.8g

NOTE : PALLADIUM PLATING

This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).

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