Data Sheet
February 1999
Outline Diagram
LG1626DXC Modulator Driver
0.465
0.280
1
1
LUCENT
LG1626DXC
XXXXXXX
0.012
0.030
0.082
0.005
0 — 0.004
Assembly Notes:
0.092
0.035
0.045
12-3224(F).a
Standoff specifications applies to package prior to solder dipping of leads and package base.
During board assembly use back lighting to silhouette the package. This will eliminate reflection problems with the
solder on the bottom of the package.
Lead space tolerance should be set to ± 0.012 in.
Board solder pattern for the package base should not exceed 50% of the package base area.
Insertion pressure should not exceed 125 grams.
LG1626DXC Ordering Information
Device
LG1626DXC
Type
24-Pin Package
Lucent Technologies Inc.
Comcode Number
108192865
9