HMC339 Ver la hoja de datos (PDF) - Hittite Microwave

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Fabricante

HMC339

GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 33 - 42 GHz

Hittite Microwave 

v01.0803

MICROWAVE CORPORATION

HMC339

GaAs MMIC SUB-HARMONICALLY

PUMPED MIXER, 33 - 42 GHz

HanGdaliAngs PMrMecIaCuStioUnBs-HARMONICALLY PUMPED MIXER 17 - 25 GHz

Follow these precautions to avoid permanent damage.

Cleanliness:

Handle the chips in a clean environment.

DO NOT attempt to clean the chip using liquid cleaning systems.

Static Sensitivity:

Follow ESD precautions to protect against > ± 250V ESD strikes.

Transients:

Suppress instrument and bias supply transients while bias is applied.

Use shielded signal and bias cables to minimize inductive pick-up.

General Handling:

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Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers.

The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or

fingers.

Mounting

The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically con-

ductive epoxy. The mounting surface should be clean and flat.

Eutectic Die Attach:

A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature

of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C.

DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3

seconds of scrubbing should be required for attachment.

Epoxy Die Attach:

Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the

perimeter of the chip once it is placed into position.

Cure epoxy per the manufacturer’s schedule.

Wire Bonding

RF bonds made with 0.003” x 0.0005” ribbon are recommended. These bonds should be thermosonically

bonded with a force of 40-60 grams. DC bonds of 0.001” (0.025 mm) diameter, thermosonically bonded, are

recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams.

All bonds should be made with a nominal stage temperature of 150 °C. A minimum amount of ultrasonic

energy should be applied to achieve reliable bonds. All bonds should be as short as possible, less than 12

mils (0.31 mm).

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

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