HMC330 Ver la hoja de datos (PDF) - Hittite Microwave
Número de pieza
componentes Descripción
Fabricante
HMC330 Datasheet PDF : 6 Pages
| |||
HMC330
v01.0301
GaAs MMIC SUB-HARMONICALLY
PUMPED MIXER, 25 - 40 GHz
TINUED Absolute Maximum Ratings
RF / IF Input
+13 dBm
LO Drive
+27 dBm
N Storage Temperature
-65 to +150 °C
ISCO T Operating Temperature
-55 to +85 °C
D DUC %,%#42/34!4)# 3%.3)4)6% $%6)#%
O /"3%26% (!.$,).' 02%#!54)/.3
PR Not Recommended
for
New
Designs
3
Outline Drawing
Die Packaging Information [1]
Standard
Alternate
WP-8
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS .004”.
3. TYPICAL BOND PAD IS .004” SQUARE.
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
3-4
Share Link: 