HT815D0 Ver la hoja de datos (PDF) - Holtek Semiconductor
Número de pieza
componentes Descripción
Fabricante
HT815D0 Datasheet PDF : 15 Pages
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Pad Assignment
K E Y 10
K E Y 11
K E Y 12
1
19
2
3
HT815D0
18 17 16
15
14 K E Y 4
13 K E Y 3
12 K E Y 2
11 K E Y 1
(0 ,0 )
VDD 4
5
6
7
8 9 10
Chip size: 2270 ´ 2840 (mm)2
* The IC substrate should be connected to VSS in the PCB layout artwork.
Pad Coordinates
Pad No.
1
2
3
4
5
6
7
8
9
10
X
-914.50
-914.50
-914.50
-987.90
-254.60
-18.90
411.90
674.70
806.10
937.90
Y
1216.45
1073.05
882.45
-1241.95
-1215.45
-1215.45
-1215.45
-1215.45
-1246.05
-1215.45
Pad No.
11
12
13
14
15
16
17
18
19
X
912.80
912.80
912.80
912.80
709.50
179.20
22.00
-156.40
-734.20
Unit: mm
Y
719.65
858.25
1053.65
1197.25
1167.75
1167.75
1167.75
1167.75
1167.75
3
March 15, 2000
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