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BTB1580SN3-0-T1-G Ver la hoja de datos (PDF) - Cystech Electonics Corp.

Número de pieza
componentes Descripción
Fabricante
BTB1580SN3-0-T1-G
CYSTEKEC
Cystech Electonics Corp. CYSTEKEC
BTB1580SN3-0-T1-G Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
CYStech Electronics Corp.
SOT-23 Dimension
Spec. No. : C655N3
Issued Date : 2017.11.27
Revised Date :
Page No. : 7/7
Marking:
Device Code
BN
Date Code: Year+Month
Year: 72017, 82018
Month: 11, 22,‧‧‧
99, A10, B11, C12
3-Lead SOT-23 Plastic
Surface Mounted Package
CYStek Package Code: N3
Style : Pin 1.Base 2.Emitter 3.Collector
DIM
Inches
Min. Max.
A 0.1102 0.1204
B 0.0472 0.0669
C 0.0335 0.0453
D 0.0118 0.0197
G 0.0669 0.0787
H 0.0000 0.0040
Millimeters
Min. Max.
2.80 3.04
1.20 1.70
0.89 1.15
0.30 0.50
1.70 2.00
0.00 0.10
DIM
Inches
Min. Max.
J 0.0032 0.0079
K 0.0197 0.0283
L 0.0335 0.0453
S 0.0830 0.1161
V 0.0098 0.0256
L1 0.0118 0.0236
Millimeters
Min. Max.
0.08 0.20
0.50 0.72
0.85 1.15
2.10 2.95
0.25 0.65
0.30 0.60
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
Lead : Pure tin plated.
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTB1580SN3
CYStek Product Specification

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