BTN1053K3 Ver la hoja de datos (PDF) - Cystech Electonics Corp.
Número de pieza
componentes Descripción
Fabricante
BTN1053K3 Datasheet PDF : 8 Pages
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CYStech Electronics Corp.
TO-92L Taping Outline
Spec. No. : C818K3
Issued Date : 2013.10.01
Revised Date : 2013.12.25
Page No. : 6/8
DIM
A1
A
T
d
d1
P
P0
P2
F1, F2
△h
W
W0
W1
W2
H
H0
L1
D0
t1
t2
P1
△P
Item
Component body width
Component body height
Component body thickness
Lead wire diameter
Lead wire diameter 1
Pitch of component
Feed hole pitch
Hole center to component center
Lead to lead distance
Component alignment, F-R
Tape width
Hole down tape width
Hole position
Hole down tape position
Height of component from tape center
Lead wire clinch height
Lead wire (tape portion)
Feed hole diameter
Taped lead thickness
Carrier tape thickness
Position of hole
Component alignment
BTN1053K3
Millimeters
Min.
Max.
4.70
5.10
7.80
8.20
3.70
4.10
0.35
0.55
0.60
0.80
12.40
13.00
12.50
12.90
6.05
6.65
2.20
2.80
-1.00
1.00
17.50
19.00
5.50
6.50
8.50
9.50
-
1.00
19.00
21.00
15.50
16.50
2.50
-
3.80
4.20
0.35
0.45
0.15
0.25
3.55
4.15
-1.00
1.00
CYStek Product Specification
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