DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

DIS0365CTSP-65-TD-G Ver la hoja de datos (PDF) - Cystech Electonics Corp.

Número de pieza
componentes Descripción
Fabricante
DIS0365CTSP-65-TD-G
CYSTEKEC
Cystech Electonics Corp. CYSTEKEC
DIS0365CTSP-65-TD-G Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
CYStech Electronics Corp.
TO-277 Dimension
Spec. No. : C065SP
Issued Date : 2017.10.13
Revised Date :
Page No. : 7/7
Anode
Cathode
Cathode
Marking:
Cathode Cathode
DIS
0365
CT
□□
Date
Code
Anode
TO-277 Plastic Surface
Mounted Package
CYStek Package Code: SP
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
A
1.05
1.15
0.041 0.045 D2
2.95
3.15
0.116 0.124
b1
0.80
0.99 0.031 0.039
E
6.40
6.60 0.252 0.260
b2
1.70
1.88 0.067 0.074 E1
5.30
5.45 0.209 0.215
b3
0.15
0.35 0.006 0.014 E2
3.45
3.65 0.136 0.144
C
0.20
0.33 0.008 0.013 E3
4.20
4.60
0.165 0.181
D
4.00
4.30 0.157 0.169
e
1.84 TYP
0.072 TYP
D1
3.90
4.05 0.154 0.159
L
0.75
0.95 0.030 0.037
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
Lead : Pure tin plated.
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
DIS0365CTSP
Preliminary
CYStek Product Specification

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]