DIS0365CTSP Ver la hoja de datos (PDF) - Cystech Electonics Corp.

Número de pieza

componentes Descripción

Fabricante

DIS0365CTSP

Switching Control Diode

Cystech Electonics Corp. 

CYStech Electronics Corp.

Spec. No. : C065SP

Issued Date : 2017.10.13

Revised Date :

Page No. : 6/7

Recommended wave soldering condition

Product

Peak Temperature

Pb-free devices

260 +0/-5 °C

Soldering Time

5 +1/-1 seconds

Recommended temperature profile for IR reflow

Profile feature

Sn-Pb eutectic Assembly

Pb-free Assembly

Average ramp-up rate

(Tsmax to Tp)

3°C/second max.

3°C/second max.

Preheat

−Temperature Min(TS min)

100°C

150°C

−Temperature Max(TS max)

−Time(ts min to ts max)

150°C

60-120 seconds

200°C

60-180 seconds

Time maintained above:

−Temperature (TL)

183°C

217°C

− Time (tL)

60-150 seconds

60-150 seconds

Peak Temperature(TP)

240 +0/-5 °C

260 +0/-5 °C

Time within 5°C of actual peak

temperature(tp)

10-30 seconds

20-40 seconds

Ramp down rate

6°C/second max.

6°C/second max.

Time 25 °C to peak temperature

6 minutes max.

8 minutes max.

Note :1. All temperatures refer to topside of the package, measured on the package body surface.

2.For devices mounted on FR-4 PCB of 1.6mm or equivalent grade PCB. If other grade PCB is used, care

should be taken to match the coefficients of thermal expansion between components and PCB. If they are

not matched well, the solder joints may crack or the bodies of the parts may crack or shatter as the

assembly cools.

DIS0365CTSP

Preliminary

CYStek Product Specification

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