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Número de pieza

componentes Descripción

Fabricante

BTA312X-800CT

3Q Hi-Com Triac

WeEn Semiconductors 

WeEn Semiconductors

BTA312X-800CT

3Q Hi-Com Triac

9. Thermal characteristics

Table 6. Thermal characteristics

Symbol

Parameter

Rth(j-h)

thermal resistance

from junction to

heatsink

Rth(j-a)

thermal resistance

from junction to

ambient

Conditions

with heatsink compound; Fig. 6

without heatsink compound; Fig. 6

in free air

Min Typ Max Unit

-

-

4

K/W

-

-

5.5 K/W

-

5

-

K/W

10

Zth(j-h)

(K/W)

1

10-1

(1)

(2)

(3)

(4)

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P

10-2

10-3

10-5

10-4

10-3

10-2

10-1

tp

t

1

10

tp (s)

(1) Unidirectional (half cycle) without heatsink compound

(2) Unidirectional (half cycle) with heatsink compound

(3) Bidirectional (full cycle) without heatsink compound

(4) Bidirectional (full cycle) with heatsink compound

Fig. 6. Transient thermal impedance from junction to heatsink as a function of pulse duration

10. Isolation characteristics

Table 7. Isolation Characteristics

Symbol

Parameter

Conditions

Visol(RMS)

RMS isolation voltage 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; from all

pins to external heatsink; sinusoidal

waveform; clean and dust free

Cisol

isolation capacitance from cathode to external heatsink

Min Typ Max Unit

-

-

2500 V

-

10 -

pF

BTA312X-800CT

Product data sheet

All information provided in this document is subject to legal disclaimers.

20 August 2020

© WeEn Semiconductors Co., Ltd. 2020. All rights reserved

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