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Número de pieza

componentes Descripción

Fabricante

BTA308X-800B0

3Q Hi-Com Triac

WeEn Semiconductors 

WeEn Semiconductors

BTA308X-800B0

3Q Hi-Com Triac

8. Thermal characteristics

Table 5. Thermal characteristics

Symbol

Parameter

Rth(j-h)

thermal resistance

from junction to

heatsink

Rth(j-a)

thermal resistance

from junction to

ambient free air

Conditions

full cycle or half cycle; with heatsink

compound; Fig. 6

full cycle or half cycle; without heatsink

compound

in free air

10

Zth(j-h)

(K/W)

1

Min Typ Max Unit

-

-

4.5 K/W

-

-

6.5 K/W

-

55

-

K/W

aaa-013261

10-1

P

10-2

10-3

10-5

10-4

10-3

10-2

10-1

1

Fig. 6. Transient thermal impedance from junction to heatsink as a function of pulse width

tp

t

10

tp (s)

9. Isolation characteristics

Table 6. Isolation characteristics

Symbol

Parameter

Visol(RMS)

RMS isolation voltage

Cisol

isolation capacitance

Conditions

from all terminals to external heatsink;

sinusoidal waveform; clean and dust

free; 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %;

Th = 25 °C

from main terminal 2 to external

heatsink; f = 1 MHz; Th = 25 °C

Min Typ Max Unit

-

-

2500 V

-

10

-

pF

BTA308X-800B0

Product data sheet

All information provided in this document is subject to legal disclaimers.

19 September 2018

© WeEn Semiconductors Co., Ltd. 2018. All rights reserved

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