BA82902YXXX-C Ver la hoja de datos (PDF) - ROHM Semiconductor
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componentes Descripción
Fabricante
BA82902YXXX-C
ROHM Semiconductor
BA82902YXXX-C Datasheet PDF : 38 Pages
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BA82904Yxxx-C BA82902Yxxx-C
Thermal Resistance(Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 3)
2s2p(Note 4)
Unit
MSOP8
Junction to Ambient
θJA
Junction to Top Characterization Parameter(Note 2)
ΨJT
284.1
21
135.4
11
°C/W
°C/W
SOP8
Junction to Ambient
θJA
Junction to Top Characterization Parameter(Note 2)
ΨJT
197.4
21
109.8
19
°C/W
°C/W
SOP14
Junction to Ambient
θJA
Junction to Top Characterization Parameter(Note 2)
ΨJT
166.5
26
108.1
22
°C/W
°C/W
SSOP-B14
Junction to Ambient
θJA
Junction to Top Characterization Parameter(Note 2)
ΨJT
159.6
13
92.8
°C/W
9
°C/W
SOP-J14
Junction to Ambient
θJA
Junction to Top Characterization Parameter(Note 2)
ΨJT
118.5
10
67.2
°C/W
10
°C/W
TSSOP-B14J
Junction to Ambient
θJA
185.4
98.4
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT
16
14
°C/W
(Note 1) Based on JESD51-2A(Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Footprints and Traces
Layer Number of
Measurement Board
4 Layers
Thickness
70μm
Material
FR-4
Board Size
114.3mm x 76.2mm x 1.6mmt
Top
Copper Pattern
Footprints and Traces
Thickness
70μm
2 Internal Layers
Copper Pattern
Thickness
74.2mm x 74.2mm
35μm
Bottom
Copper Pattern
74.2mm x 74.2mm
Thickness
70μm
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TSZ22111 • 15 • 001
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TSZ02201-0GLG0G200040-1-2
20.Feb.2018 Rev.007
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