MKE02Z64VQH2 Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza

componentes Descripción

Fabricante

MKE02Z64VQH2

KE02 Sub-Family Data Sheet

NXP Semiconductors. 

Ratings

4 Ratings

4.1 Thermal handling ratings

Symbol

TSTG

TSDR

Description

Storage temperature

Solder temperature, lead-free

Min.

–55

—

Max.

150

260

Unit

Notes

°C

1

°C

2

1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.

2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices.

4.2 Moisture handling ratings

Symbol Description

MSL Moisture sensitivity level

Min.

—

Max.

3

Unit

Notes

—

1

1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices.

4.3 ESD handling ratings

Symbol

VHBM

VCDM

ILAT

Description

Electrostatic discharge voltage, human body model

Electrostatic discharge voltage, charged-device model

Latch-up current at ambient temperature of 125°C

Min.

–6000

–500

–100

Max.

+6000

+500

+100

Unit

V

V

mA

Notes

1

2

3

1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body

Model (HBM).

2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for

Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.

3. Determined according to JEDEC Standard JESD78D, IC Latch-up Test.

• Test was performed at 125 °C case temperature (Class II).

• I/O pins pass ±100 mA I-test with IDD current limit at 800 mA.

• I/O pins pass +60/-100 mA I-test with IDD current limit at 1000 mA.

• Supply groups pass 1.5 Vccmax.

• RESET pin was only tested with negative I-test due to product conditioning requirement.

KE02 Sub-Family Data Sheet, Rev. 7, 12/2019

6

NXP Semiconductors

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