LTM4656Y Ver la hoja de datos (PDF) - Analog Devices
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LTM4656Y Datasheet PDF : 28 Pages
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LTM4656/LTM4656-1
ABSOLUTE MAXIMUM RATINGS
(Note 1)
VIN, SENSE1, BVIN, SW, VOUT,
SHDN, UV, FLT, VBIAS.................................. –0.3V to 36V
INTVCC, MODE_PLLIN, PGOOD.................... –0.3V to 6V
FREQ, SS, COMP, VFB............................ –0.3V to INTVCC
RUN.............................................................. –0.3V to 5V
TMR.......................................................................0.5mA
TEMP+, TEMP–.................... <0.7V Across Pins, No More
than 5mA (Current Source)
Operating Junction Temperature (Note 2)... –40 to 125°C
Storage Temperature Range....................... –55 to 125°C
Peak Solder Reflow Body Temperature.................. 245°C
Note: Not recommended for upside-down reflow.
PIN CONFIGURATION
(See Capacitor Matrix, Pin Configuration Table)
TOP VIEW
1 2 3 4 5 6 7 8 9 10 11 12
A
B
BVIN
C
SENSE1
GND
VIN
D
NC
GND
GND VFB
E
SHDN
F
COMP SS PGOOD VBIAS GND
GND TMR MODE_PLLIN
INTVCC
G
UV FLT TEMP+ TEMP– FREQ RUN
GND
H
J
K
VOUT
L
M
GND
SW
GND
BGA PACKAGE
144-LEAD (16mm × 16mm × 7.07mm)
TJMAX = 125°C, θJA = 11.8°C/W,
θJCtop = 7.1°C/W, θJCbot = 4.4°C/W (Note 7)
WEIGHT = 4.22g
ORDER INFORMATION
PART NUMBER
LTM4656EY#PBF
LTM4656IY#PBF
LTM4656IY
LTM4656EY-1#PBF
LTM4656IY-1#PBF
LTM4656IY-1
PAD OR BALL FINISH
SAC305 (RoHS)
SAC305 (RoHS)
SnPb (63/37)
SAC305 (RoHS)
SAC305 (RoHS)
SnPb (63/37)
PART MARKING*
DEVICE
FINISH CODE
e1
e1
e0
LTM4656Y
e1
e1
e0
PACKAGE TYPE
BGA
MSL RATING
4
TEMPERATURE
RANGE (Note 2)
−40°C to 125°C
−40°C to 125°C
−40°C to 125°C
−40°C to 125°C
−40°C to 125°C
−40°C to 125°C
• Contact the factory for parts specified with wider operating temperature
ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures
• LGA and BGA Package and Tray Drawings
Rev. 0
2
For more information www.analog.com
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