LTM4604AIY Ver la hoja de datos (PDF) - Analog Devices
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LTM4604AIY Datasheet PDF : 22 Pages
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LTM4604A
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN, PGOOD.................................................. –0.3V to 6V
COMP, RUN/SS, FB, TRACK......................... –0.3V to VIN
SW, VOUT....................................... –0.3V to (VIN + 0.3V)
Internal Operating Temperature Range
(Note 2)................................................... –40°C to 125°C
Storage Temperature Range................... –55°C to 125°C
Peak Solder Reflow Body Temperature:
BGA................................................................... 245°C
LGA.................................................................... 260°C
PIN CONFIGURATION
TOP VIEW
TRACK PGOOD
ABCDE FG
VIN
1
COMP
2
RUN/
SW
SS
FB
3
GND
4
5
6
7
8
9
10
11
GND
VOUT
BGA PACKAGE
66-PIN (15mm × 9mm × 3.42mm)
TJMAX = 125°C, θJA = 25°C/W, θJC(BOTTOM) = 7°C/W, θJC(TOP) = 50°C/W, WEIGHT = 1.1g
TOP VIEW
TRACK PGOOD
ABCDE FG
VIN
1
COMP
2
RUN/
SW
SS
FB
3
GND
4
5
6
7
8
9
10
11
GND
VOUT
LGA PACKAGE
66-PIN (15mm × 9mm × 2.32mm) 0.630mm PAD
TJMAX = 125°C, θJA = 25°C/W, θJC(BOTTOM) = 7°C/W, θJC(TOP) = 50°C/W, WEIGHT = 1.0g
ORDER INFORMATION
PART MARKING*
PART NUMBER
PAD OR BALL FINISH
DEVICE
FINISH CODE
LTM4604AEV#PBF
Au (RoHS)
LTM4604AV
e4
LTM4604AIV#PBF
Au (RoHS)
LTM4604AV
e4
LTM4604AEY#PBF
SAC305 (RoHS)
LTM4604AY
e1
LTM4604AIY#PBF
SAC305 (RoHS)
LTM4604AY
e1
LTM4604AIY
SnPb (63/37)
LTM4604AY
e0
• Contact the factory for parts specified with wider operating temperature ranges.
*Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Device temperature grade is indicated by a label on the shipping container.
PACKAGE
TYPE
MSL TEMPERATURE RANGE
RATING (SEE NOTE 2)
LGA
4
–40°C to 125°C
LGA
4
–40°C to 125°C
BGA
4
–40°C to 125°C
BGA
4
–40°C to 125°C
BGA
4
–40°C to 125°C
• Recommended LGA and BGA PCB Assembly and
Manufacturing Procedures
• LGA and BGA Package and Tray Drawings
Rev. D
2
For more information www.analog.com
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