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MAX9637(2011) Ver la hoja de datos (PDF) - Maxim Integrated

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componentes Descripción
Fabricante
MAX9637 Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
3V/5V Low-Power, Low-Noise, CMOS,
Rail-to-Rail I/O Op Amps
ABSOLUTE MAXIMUM RATINGS
VDD, SHDN to VSS...................................................-0.3V to +6V
IN+, IN-, OUT.....................................GND - 0.3V to VDD + 0.3V
Continuous Input Current (any pins)............................... Q20mA
Output Short Circuit to VDD or VSS Duration........................... 5s
Thermal Limits (Note 1)
Multiple Layer PCB
Continuous Power Dissipation (TA = +70NC)
6-Pin SC70 (derate 3.1mW/°C above +70NC).............245mW
BJA. ...................................................................... 326.5°C/W
BJC .........................................................................115°C/W
8-Pin SC70 (derate 3.1mW/NC above +70NC).............245mW
BJA .........................................................................326°C/W
BJC .........................................................................115NC/W
10-Pin UTQFN (derate 7mW/NC above +70NC)........558.7mW
BJA ......................................................................143.2NC/W
BJC.........................................................................20.1NC/W
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering 10s)..................................+300NC
Soldering Temperature (reflow).......................................+260NC
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDD = 3.3V, VSS = 0V, VIN+ = VIN- = VCM = VDD/2, RL = 10kI to VDD/2, SHDN = VDD, TA = -40NC to +125NC. Typical values are
at TA = +25NC, unless otherwise noted.) (Note 2)
PARAMETER
DC CHARACTERISTICS
Input Voltage Range
Input Offset Voltage
Input Offset Voltage Drift
(Note 3)
Input Bias Current (Note 3)
Common-Mode Rejection Ratio
Open-Loop Gain
Output Short-Circuit Current
Output Voltage Low
Output Voltage High
Output Leakage in Shutdown
SYMBOL
CONDITIONS
MIN
VIN+, VIN- Guaranteed by CMRR
VOS
TCVOS
IB
CMRR
AOL
ISC
VOL
VOH
TA = +25NC
TA = -40NC to +125NC
MAX9636 only
MAX9637, MAX9638 only
TA = +25NC
TA = -40NC to +85NC
TA = -40NC to +125NC
VSS < VCM <
(VDD - 1.4V)
TA = +25NC
TA = -40NC to +125NC
(VSS - 0.1V) < VCM < (VDD + 0.1V)
VOUT = 0.25V from rails
VOUT = 0.4V from rails, RL = 600I
Short to VDD
Short to VSS
VOUT
RL = 10kI
RL = 600I
VDD - VOUT
RL = 10kI
RL = 600I
SHDN = VSS, VOUT = 0V to VDD (MAX9636,
MAX9638 only)
VSS -
0.1
72
68
58
104
100
TYP MAX UNITS
0.01
±0.1
86
77
124
120
55
40
0.014
0.044
0.019
0.057
VDD +
0.1
2.2
3.5
7
10
±0.8
±50
±800
0.03
0.08
0.04
0.1
V
mV
FV/NC
pA
dB
dB
mA
V
V
0.01
1
FA
2

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