RMWL26001 Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
RMWL26001 Datasheet PDF : 8 Pages
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0.0
0.621
1.870
2.223
2.721
0.451
0.600
0.0
0.0 0.301
1.154
1.701
2.690
Dimensions in mm
Figure 2. Chip Layout and Bond Pad Locations
(Chip Size is 3.0mm x 1.25mm x 100µm. Back of chip is RF and DC Ground)
RF IN
10,000pF
100pF L
L
MMIC CHIP
DRAIN SUPPLY
Vd = +4V
L = BOND WIRE INDUCTANCE
L
L
100pF
L
L
100pF
L
L
10,000pF
L 100pF
L
RF OUT
L
L
L
100pF
GROUND
(Back of Chip)
100pF
L
L
GATE SUPPLY
Vg
100pF
Figure 3. Recommended Application Schematic Circuit Diagram
©2004 Fairchild Semiconductor Corporation
RMWL26001 Rev. D
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