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DS1330WP-100 Ver la hoja de datos (PDF) - Dallas Semiconductor -> Maxim Integrated

Número de pieza
componentes Descripción
Fabricante
DS1330WP-100
Dallas
Dallas Semiconductor -> Maxim Integrated Dallas
DS1330WP-100 Datasheet PDF : 12 Pages
First Prev 11 12
DS1330W
DS1330W NONVOLATILE SRAM, 34-PIN POWERCAP MODULE WITH
POWERCAP
PKG
DIM
A
B
C
D
E
F
G
MIN
0.920
0.955
0.240
0.052
0.048
0.015
0.020
INCHES
NOM
0.925
0.960
0.245
0.055
0.050
0.020
0.025
MAX
0.930
0.965
0.250
0.058
0.052
0.025
0.030
ASSEMBLY AND USE
Reflow soldering
Dallas Semiconductor recommends that
PowerCap Module bases experience one pass
through solder reflow oriented label-side up
(live bug).
Hand soldering and touch-up
Do not touch soldering iron to leads for more
than 3 seconds. To solder, apply flux to the
pad, heat the lead frame pad and apply
solder. To remove part, apply flux, heat pad
until solder reflows, and use a solder wick.
LPM replacement in a socket
To replace a Low Profile Module in a 68-pin
PLCC socket, attach a DS9034PC PowerCap
to a module base then insert the complete
module into the socket one row of leads at a
time, pushing only on the corners of the cap.
Never apply force to the center of the device.
To remove from a socket, use a PLCC
extraction tool and ensure that it does not hit
or damage any of the module IC
components. Do not use any other tool for
extraction.
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