NCP161 Ver la hoja de datos (PDF) - ON Semiconductor

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Fabricante

NCP161

LDO Regulator for RF and Analog Circuits - Ultra-Low Noise and High PSRR 450 mA

ON Semiconductor 

IN

EN

NCP161

BANDGAP

REFERENCE

ENABLE

LOGIC

INTEGRATED

SOFT−START

THERMAL

SHUTDOWN

MOSFET

DRIVER WITH

CURRENT LIMIT

OUT

* ACTIVE DISCHARGE

Version A only

EN

GND

Figure 2. Simplified Schematic Block Diagram

PIN FUNCTION DESCRIPTION

Pin No. Pin No. Pin No. Pin

CSP4 SOT23−5 XDFN4 Name

Description

A1

1

4

IN Input voltage supply pin

A2

5

1

OUT Regulated output voltage. The output should be bypassed with small 1 mF ceramic capacitor.

B1

3

B2

2

3

EN Chip enable: Applying VEN < 0.4 V disables the regulator, Pulling VEN > 1.2 V enables the LDO.

2

GND Common ground connection

−

−

EPAD EPAD Expose pad should be tied to ground plane for better power dissipation

ABSOLUTE MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage (Note 1)

VIN

−0.3 V to 6

V

Output Voltage

VOUT

−0.3 to VIN + 0.3, max. 6

V

Chip Enable Input

VCE

−0.3 to 6

V

Output Short Circuit Duration

tSC

unlimited

s

Maximum Junction Temperature

TJ

150

°C

Storage Temperature

TSTG

−55 to 150

°C

ESD Capability, Human Body Model (Note 2)

ESDHBM

2000

V

ESD Capability, Machine Model (Note 2)

ESDMM

200

V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per EIA/JESD22−A114

ESD Machine Model tested per EIA/JESD22−A115

Latchup Current Maximum Rating tested per JEDEC standard: JESD78.

THERMAL CHARACTERISTICS

Rating

Symbol

Value

Thermal Characteristics, CSP4 (Note 3)

Thermal Resistance, Junction−to−Air

108

Thermal Characteristics, XDFN4 (Note 3)

Thermal Characteristics, SOT23−5 (Note 3)

Thermal Resistance, Junction−to−Air

Thermal Resistance, Junction−to−Air

RqJA

198.1

218

3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7

Unit

°C/W

www.onsemi.com

2

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