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NCP161(2015) Ver la hoja de datos (PDF) - ON Semiconductor

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NCP161 Datasheet PDF : 19 Pages
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NCP161
IN
EN
BANDGAP
REFERENCE
ENABLE
LOGIC
INTEGRATED
SOFT−START
THERMAL
SHUTDOWN
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT
* ACTIVE DISCHARGE
Version A only
EN
GND
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
CSP4
Pin No.
XDFN4
Pin
Name
Description
A1
4
IN
Input voltage supply pin
A2
2
OUT Regulated output voltage. The output should be bypassed with small 1 mF ceramic capacitor.
B1
3
EN
Chip enable: Applying VEN < 0.4 V disables the regulator, Pulling VEN > 1.2 V enables the LDO.
B2
2
GND Common ground connection
EPAD
EPAD Expose pad should be tied to ground plane for better power dissipation
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage (Note 1)
VIN
−0.3 V to 6
V
Output Voltage
VOUT
−0.3 to VIN + 0.3, max. 6 V
V
Chip Enable Input
VCE
−0.3 to VIN + 0.3, max. 6 V
V
Output Short Circuit Duration
tSC
unlimited
s
Maximum Junction Temperature
TJ
150
°C
Storage Temperature
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating
Thermal Characteristics, CSP4 (Note 3)
Thermal Resistance, Junction−to−Air
Thermal Characteristics, XDFN4 (Note 3)
Thermal Resistance, Junction−to−Air
Symbol
RqJA
Value
108
198.1
Unit
°C/W
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