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MURB1660CT Ver la hoja de datos (PDF) - Thinki Semiconductor Co., Ltd.

Número de pieza
componentes Descripción
Fabricante
MURB1660CT Datasheet PDF : 2 Pages
1 2
MURB1620CT thru MURB1660CT
Pb Free Plating Product
Pb
MURB1620CT/MURB1630CT/MURB1640CT/MURB1660CT
16.0 Ampere Surface Mount Dual Common Cathode Ultra Fast Recovery Rectifiers
Features
¬ Latest GPP EPI P/G Technology
¬ Good Soft Recovery Characteristics
¬ Ideally Suited for Automatic Assembly
¬ Low Forward Voltage
¬ High Surge Current Capability
¬ Low Leakage Current
D2PAK/TO-263
Unit : inch (mm)
Applications
¬ Freewheeling, Snubber, Clamp
¬ Inversion Welder
¬ PFC
¬ Plating Power Supply
¬ Ultrasonic Cleaner and Welder
¬ Converter & Chopper
¬ UPS/LED SMPS/HID
Case
Case
Case
Case
Positive
Negative
Doubler
Series
Common Cathode Common Anode Tandem Polarity Tandem Polarity
Suffix "CT"
Suffix "CTR"
Suffix "CTD" Suffix "CTS"
Maximum Ratings and Electrical Characteristics @TA=25°C unless otherwise specified
Single Phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
@TC = 100°C
Total Device
Per Diode
Non-Repetitive Peak Forward Surge Current
8.3ms Single Half Sine-Wave Superimposed on
Rated Load (JEDEC Method)
Forward Voltage per diode
@IF = 8.0A
Peak Reverse Current
At Rated DC Blocking Voltage
@TC = 25°C
@TC = 100°C
Reverse Recovery Time (Note 1)
Typical Junction Capacitance (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Thermal Resistance Junction to Lead (Note 3)
Operating and Storage Temperature Range
Symbol
VRRM
VRWM
VR
VR(RMS)
IO
MURB1620CT MURB1630CT MURB1640CT MURB1660CT Unit
200
300
400
600
V
140
210
280
420
V
16.0
8.0
A
IFSM
150
A
V FM
IRM
trr
CJ
RθJA
RθJC
TJ, TSTG
0.98
70
1.3
5.0
100
35
50
30
1.5
-55 to +150
1.7
V
µA
nS
pF
°C/W
°C
Note: 1. Measured with IF = 0.5A, IR = 1.0A, IRR = 0.25A.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0 V DC.
3. Mounted on PCB with minimum recommended pad sizes per diode.
Rev.08T
© 1995 Thinki Semiconductor Co., Ltd.
Page 1/2
http://www.thinkisemi.com.tw/

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