HMC8142 Ver la hoja de datos (PDF) - Analog Devices
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HMC8142 Datasheet PDF : 16 Pages
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Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
4
GND
5
VDD1
6
GND
7
VDD2
8
GND
9
VDD3
10
GND
11
VDD4
HMC8142
3
GND
2
RFIN
1
GND
HMC8142
TOP VIEW
(Not to Scale)
GND
12
RFOUT 13
GND
14
GND
25
VGG1
GND
VGG2
24
23
22
GND
21
VGG3
GND
VGG4
20
19
18
Figure 2. Pad Configuration
GND
17
VREF
16
VDET
15
Table 4. Pad Function Descriptions
Pad No.
Mnemonic
1, 3, 4, 6, 8, 10, 12, 14, GND
17, 19, 21, 23, 25
2
RFIN
5, 7, 9, 11
VDD1 to VDD4
13
RFOUT
15
VDET
16
VREF
18, 20, 22, 24
Die Bottom
VGG4 to VGG1
GND
Description
Ground Connection (See Figure 3).
RF Input. AC couple RFIN and match it to 50 Ω (See Figure 4).
Drain Bias Voltage for the Power Amplifier (See Figure 5).
RF Output. AC couple RFOUT and match it to 50 Ω (see Figure 6).
Detector Voltage for the Power Detector (See Figure 7). VDET is the dc voltage representing the RF
output power rectified by the diode, which is biased through an external resistor. Refer to the
typical application circuit for the required external components (see Figure 40).
Reference Voltage for the Power Detector (See Figure 7). VREF is the dc bias of diode biased through
an external resistor used for the temperature compensation of VDET. Refer to the typical application
circuit for the required external components (see Figure 40).
Gate Bias Voltage for the Power Amplifier (See Figure 8). Refer to the typical application circuit for
the required external components (see Figure 40).
Ground. The die bottom must be connected to the RF/dc ground (see Figure 3).
Rev. A | Page 5 of 16
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